By: Chris Benson, Packaging Specialist
Well, another PackExpo has come and gone. This year’s show was in Chicago during late October. While the Chicago weather was windy and cold, inside the trade show it was a successful event.
The entire ACH sales team would like to thank everyone who stopped by the ACH Foam booth. It was great to see our current customers and meet the new prospects who stopped by.
ACH proudly displayed our capabilities within the packaging and OEM markets. From DuraTherm® coolers, loosefill packaging peanuts, to fabricated EPS, we had interest from everyone who stopped by in all of our product categories.
By now, anyone who stopped by the booth and let us scan you have been contacted. If you were not one of the lucky ones to get scanned, stop by our website to contact a sales person in your area.
ACH looks forward to seeing you at PackExpo 2013 in Las Vegas!
